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 Flex PCB |
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Electronic devices have taken upon a prominent part of our everyday lives. The extensive range of devices from cell-phones to servers,
regardless of their sizes and uses are now being designed to be flexible, lightweight and efficient. While they all come in diverse shapes,
sizes and functionalities, there is one thing in common - they include flexible printed circuits boards.
Capability List of Flexible PCB
| MATERIAL | ITEM | Standard Thickness | ||||
| Substrate | Copper Foil | Electro Deposited Copper Foil | 11.7um | 17.5um | 35um | 70um |
| Rolled Anneal Copper Foil | 11.7um | 17.5um | 35um | 70um | ||
| Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
| Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
| Base Film | Polymide(PI) | 12.7um | 25.4um | 50.8um | 76.2um | |
| Polyester(PET) | 12.7um | 25.4um | 50.8um | 76.2um | ||
| Solder Mask | Coverlay | Polymide(PI) | 12.7um | 25.4um | 50.8um | |
| Polyester(PET) | 12.7um | 25.4um | 50.8um | |||
| Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
| Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
| SolderMask | UV Cure | 10um — 20um | ||||
| Thermal Post Cure | 10um — 20um | |||||
| Stiffener | Material | FR4 | 200um-1600um | |||
| Polymide(PI) | 12.7um | 25.4um | 50.8um | |||
| Polyester(PET) | 2.54um | 3.81um | 4.78um | |||
| Stainless Steel | 150um | 200um | ||||
| Adhesive | Thermosetting Adhesive | 12.7um | 25.4um | 50.8um | ||
| Pressure Sensitive Adhesive | 12.7um | 25.4um | 50.8um | |||
| TECHNOLOGY SPECIFICATIONS | ||||||
| PROCESS | ITEM | SIZE & THICKNESS | TOLERANCE & Remarks | |||
| Drill | Min hole size (mechanical) | 0.15mm | ±0.05mm(H≤1.5mm) | |||
| Min hole size (laser) | <0.15mm | |||||
| Min hole size (punch) | 0.50mm | ±0.05mm(H≤1.5mm) | ||||
|
Pattern Transfer |
Min line width | 0.05mm | ±0.02mm(W≤0.05mm) | |||
| Min line gap | 0.05mm | ±0.02mm(W≤0.05mm) | ||||
| Panel | Max board size | 250*500mm | ±0.07mm(L≤50mm) | |||
|
Surface Treatment |
Flash Gold | 0.2um — 3um | ||||
| Immersion Gold | 0.025 — 0.075mm | |||||
| Tin Plating | 0.2um — 10um | |||||
| Immersion Tin | 0.025um — 0.075um | |||||
| Tin/lead Plating | 0.05um — 10um | |||||
| OSP | 0.2um — 0.5um | |||||
| HAL | 0.075um — 5um | |||||
| Parameter | Insulation Resistance | 1000m | IPC-TM-650.2.6.3.2 | |||
| Dielectric Strength | 5KV | IPC-TM-650.2.5.6.1 | ||||
| Surface Resistance | 5*1012Ω ‖ 5*1015Ω | IPC-TM-650.2.5.17 | ||||
| Body Resistance Value | 1*1015Ω ‖ 1*1015Ω | IPC-TM-650.2.5.17 | ||||
| Dielectric Constant | 4.0 ‖ 3.0 | MIL-P-55617 | ||||
| Transpiration Coefficient | 0.04 ‖ 0.03 | MIL-P-55617 | ||||
| Peeling Strength | 1.0 kg f/cm ‖ 1.2 kg f/cm | IPC-TM-650.2.4.9 | ||||
| Solder Heat Resistance | 300 ℃/10sec ‖ 210 ℃/10sec | |||||
| Flammability Retardant | 94VTM-O ‖ 94VTM-O | U194 | ||||
