HDI PCB

The continuous trend towards further miniaturization in electronics inevitably leads to a growing integration
density.

As an authorized agent of Foxconn , we are specializing in providing HDI PCB for many years. 

The following leading technologies make us the top supplier for customer’s HDI demand. 
 
HDI PCB fabrication
Via in pad
Any layer interconnection
Blind and Buried via
plus III laser drilling
Copper filling to blind via
2.5mil fine line and space
Skipped and stepped holes

For more information about HDI PCB, please visit  HDI PCB Capability
        
 

10 Layers HDI Any layer interconnection FR4 1.00mm HOZ Immersion Gold+OSP 3/3mil Mother board of cell phone

4 Layers HDI 1+2+1copper filling FR4 1.00mm HOZ Immersion Gold 2.5/2.5mil Used for mobile

 

     

6 Layers HDI 1+4+1 FR4 1.20mm HOZ Immersion Gold+OSP 2.8/3mil Mobile mother board

10 Layers HDI 3+4+3    FR4 1.00mm HOZ          Immersion Gold+OSP    2.5/2.5mil           Cell phone mother board

                         

                

8 Layers FR4 1.60MM 1OZ Immersion Gold Green Solder Mask 6/7mil Used for laptop

8 Layers HDI 1+6+1 FR4 1.60MM HOZ Immersion Gold 3/3mil Notebook board