Immersion Silver Plating is a surface plating technology used for Printed Circuit Boards,it is deposited directly on the copper
surface by a chemical displacement reaction and is available in the industry all co-deposit and organic anti tarnish with the
immersion silver. This reaction is fast and does not require the relatively high temperatures of ENIG

Immersion Silver finish (also referred to as 'IAg'), provides a ROHS compliant finish for printed circuit boards (pcbs), but is
thinner than ENIG or traditional HASL finish. Immersion silver offers better performance and superior finishes for final
finishes on PCBs, and has been generally favored by clients.
 
Handling, packaging, and storage are the most challenge in the production of PCBs. It have to be more carefully when
immersion silver are done. Packaging of immersion silve printed circuit board is very important, it has to minimize contact
of the surface with the environment and to ensure all materials used in the packaging and during storage are sulfur free.

Please visit Conventional PCB to check our surface finish list
Multilayer Printed Circuit Board
FR4 1.60mm thickness
1OZ finish copper thickness
Immersion Silver Surface Treatment
6mil min track/space
0.20mm min hole size
Blue solder mask 6 Layer pcb
FR4 2.40mm thickness
1oz base copper
Immersion Silver surface finish
Min line/Space: 4.5/5mil
Min Hole: 0.20mm BGA