Cell Phone PCB _PCBSourcing is Professional PCB supplier from China.

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Mobile Phone PCB

The continuous trend towards further miniaturization in electronics inevitably leads to a growing integration density and
cell phone is the one that shows this in morden life. In order to reach more function on a smaller electronics, HDI pcs were
designed and produced.

As an authorized agent of Foxconn , we are specializing in providing HDI PCB for many years.

The following leading technologies make us the top supplier for customer’s HDI demand.

HDI PCB fabrication
Via in pad
Any layer interconnection
Blind and Buried via
plus III laser drilling
Copper filling to blind via
2.5mil fine line and space
Skipped and stepped holes

Please visit HDI PCB to check our capability list for cell phone pcbs.



                        8 Layer Printed Circuit Board                                                                                          6 Layer pcbs
                        FR4 1.0MM Board Thickness                                                                                  FR4 1.0MM Board Thickness
                     Immersion Gold + Selective OSP                                                                          Immersion Gold + Selective OSP
                                Stack up      2+4+2                                                                                                      Stack up 2+2+2
                         Min Track/Width 3/3mil                                                                                              Min Track/Width 3/4mil
                                 Buried Holes                                                                                                              Buried Laser Holes
                        Designed for Cell Phone                                                                                             Designed for Cell Phone



                             4 Layer pcb                                                                                                                        10 Layer pcbs
                 FR4 1.0MM Board Thickness                                                                                        FR4 1.0MM Board Thickness
               Immersion Gold + Selective OSP                                                                                 Immersion Gold + Selective OSP
                             Stack up 1+2+1                                                                                                                Stack up 2+6+2
                        Min Track/Width 3/2.5mil                                                                                                 Min Track/Width 3/4mil
                               Buried Holes                                                                                                                  Blind Laser Holes
                           Used for Cell Phone                                                                                                    Designed for Mobile Phone