HASL PCB

HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCB).

The PCB is typically dipped into a bath of molten solder such that all exposed copper surfaces are covered by solder. Excess solder
is removed by scraping the PCB with hot air knives.The HASL process consists of a pre-clean, fluxing, hot air leveling, and a post-clean.
Pre-cleaning is usually done with a micro-etch.
 
Despite the effection of Rohs compliance in 2006, normal hasl finish (hot air solder leveling) is still requested nowadays for special
products or purpose.
 
Hasl finish has excellent wetting during component soldering which is better than lead free hasl finish; but the hot air solder leveling
on printed circuit board are unsuitable for use with fine pitch components because of low planarity and high thermal stress during
process may introduce defects to pcbs.

Please visit Conventional PCB to check our Surface Treatment finish. 

2 Sided Printed Circuit Board
2.40mm board thickness
2OZ finish copper thickness
Normal Hasl surface Finish
Min Track/Space: 6/6mil
Min hole: 0.40mm
Solder Mask: Matt Black

6 Sided Printed Circuit Board
3.20mm board thickness
1OZ finish copper thickness
Normal Hasl surface Finish
Min Track/Space: 4/5mil
Min hole: 0.40mm
Solder Mask: Green
BGA