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Power Application PCB

When we talk about power applications, there are definitely two challenges which need solving, the first question is thermal management, and the second question is the design of the current carrying systems. Mixed up with EMC requirements, plus the continuous demand for smaller devices, plus production efficiency and last but not least, the cost reduction, you gain an exciting play on balancing technical and economic issues
 

Besides, it needs to be considered reasonable design of earthed-wire, the integrality of signal, heat elimination, lightning protection and resist lighting.

Now, we are glad that most of China PCB manufacturers or factories have solved above problem.

Please visit heavy copper pcb to check our capability list for power application pcb.

Multilayer printed circuit board (8 Layer)
Fr4 Material 1.60mm thickness
3oz Basic Copper
Green Solder Mask
5/5 mil min track/space
2.0mm hole thickness
ENIG Surface Treatment
Power Application
PCB Brand: China PCB Supplier
4 Layer Circuit Board
Fr4 Material 1.60mm thickness
3oz Finish Copper
Green Solder Mask
5/5 mil min track/space
2.0mm hole thickness
ENIG Surface Treatment
Designed for Power Application
China PCB Supplier